Automatisk Bonder
Buyer: Københavns Universitet
- Published
- 3 July 2024
- Place of performance
- DK011
- Procedure
- Negotiated procedure
- Lots
- 1
- Notice number
- 00396347-2024
- Reference
- 08c80265-f770-4bed-8ff2-a994452bef99
- Official source
- Official source
CPV codes
- 42661000Equipos de soldadura blanda y de soldadura fuerte
Description
Vi har brug for én automatisk bonder (sy-maskine med metaltråd som bruges til produktion og test and mikro-kredsløb). Udstyret skal leveres og installeres på Blegdamsvej. Firmaet skal oplære og supportere i fremtiden. Automatic bonding Especially for the R&D and engineering part of our work, fast and reliable bonding is essential. Automatic bonding both saves many work hours and produces more reliable results than manual or semi-automatic bonding does. Al wedge bonding For our superconducting qubit platform, it is essential that our bond wires also turn superconducting at mK temperatures. This is indeed the case for regular Si-doped Al bond wire. This wire is also usually used for semiconducting qubits. Au ball bonding For our photonic platform, on the other hand, Au ball bonding is required. Ball bonding applies less mechanical force. Some of the photonic structures are fragile and others have a risk of leaking to deeper layers in the heterostructure. Fast switching of the full bonding head including wedge and wire. We expect to have many daily uses of the bonder, using both types of wire. It is therefore crucial that the switch between the two is very fast (below 10 min) and with…
Award criteria
- Quality — Priserne er sammenlignelige men kun F&S Bondtec har en acceptabel løsning til udskiftning af bonderhovedet hvor spolen og nålen også følger med. Denne feature er essentiel for vores…
Awards
| Awarded to | Amount | Date |
|---|---|---|
| F&S Bondtec | — | — |
Official publications
- TED · 00396347-2024 · 3 July 2024
- OJS · 128/2024 · 3 July 2024
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